Board & Systems Assembly

SunSil is proud to represent some of the leading manufacturers in support of Integrated Circuit Board and Systems Assembly process and requirements;

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• Wafer Packing and Shipping Materials
  
• Anti Static ESD safe Materials
  
• ST-Poly Conductive Coatings
  

• Fiber Laser Marking Systems and
• Industrial Lasers for variety of applications.

• Solder flux – No clean & water soluble as well as various other formulations

• Full turnkey Wafer Probe, Component Assembly & Final Test Manufacturing Services (OSAT) For Optical and MEMS products only.
  

• Solder spheres, Gold wire and Pladium coated Copper wire.
  

• Wafer Level Solder Ball Placement Systems
  
• Strip Level Solder Ball Placement Systems
  
• Flip Chip Die Bonders
  

• Ultra High Temp (270C) Process Trays/Boats
  
• Shipping Trays (Jedec and Custom)
  
• Tape & Reel
  
• Moisture Barrier Bags
  

• Full turnkey wafer probe component module assembly, and final test manufacturing sevices (OSAT)
  

• 2D and 3D Package Inspection Systems
  
• Wafer Bump Inspections Systems