• Home
  • Products & Services
    • Wafer Fabrication
    • Component Assembly
    • Wafer Probe & Final Test
    • Board & Systems Assembly
    • Mergers & Acquisitions
  • About
  • Global Presence
  • Contact

Board & Systems Assembly

SunSil is proud to represent some of the leading manufacturers in support of Integrated Circuit Board and Systems Assembly process and requirements;
Click Partner Logos to Visit
Picture
  • Wafer Packing and Shipping Materials
  • Anti Static ESD safe Materials
  • ST-Poly Conductive Coatings
Picture
  • Fiber Laser Marking Systems and
  • Industrial Lasers for variety of applications.
Picture
  • Solder flux – No clean & water soluble as well as various other formulations
Picture
  • Full turnkey Wafer Probe, Component Assembly & Final Test Manufacturing Services (OSAT) For Optical and MEMS products only.
Picture
  • Solder spheres, Gold wire and Pladium coated Copper wire.
Picture
  • Wafer Level Solder Ball Placement Systems
  • Strip Level Solder Ball Placement Systems
  • Flip Chip Die Bonders
Picture
  • Ultra High Temp (270C) Process Trays/Boats
  • Shipping Trays (Jedec and Custom)
  • Tape & Reel
  • Moisture Barrier Bags
Picture
  • Full turnkey wafer probe component module assembly, and final test manufacturing sevices (OSAT)
Picture
  • 2D and 3D Package Inspection Systems
  • Wafer Bump Inspections Systems
Powered by Create your own unique website with customizable templates.