Products & Services
Wafer Probe & Final Test
Board & Systems Assembly
Mergers & Acquisitions
SunSil is proud to represent some of the leading manufacturers in support of Integrated Circuit Assembly process and requirements;
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Wafer Packing and Shipping Materials
Anti Static ESD safe Materials
ST-Poly Conductive Coatings
Fiber Laser Marking Systems and
Industrial Lasers for variety of applications.
Solder flux – No clean & water soluble as well as various other formulations
Full turnkey Wafer Probe, Component Assembly & Final Test Manufacturing Services (OSAT) For Optical and MEMS products only.
Solder spheres, Gold wire and Pladium coated Copper wire.
CMP Pad Conditioners.
Micro Ball Bumping for Wafer Bumping
Wafer Level Solder Ball Placement Systems
Strip Level Solder Ball Placement Systems
Flip Chip Die Bonders
Ultra High Temp (270C) Process Trays/Boats
Shipping Trays (Jedec and Custom)
Tape & Reel
Moisture Barrier Bags
Full turnkey wafer probe component module assembly, and final test manufacturing sevices (OSAT)
ADP Dry Etch Wafer Thinning Equipment
Thin Wafer Non-Contact Handling Systems
Organic substrates for Flip Chip, BGA & CSP packages
2D and 3D Package Inspection Systems
Wafer Bump Inspections Systems
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