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Wafer Probe & Final Test
SunSil is proud to represent some of the leading manufacturers in support of
Integrated
Circuit Probe and Final Test
process and requirements;
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Wafer Packing and Shipping Materials
Anti Static ESD safe Materials
ST-Poly Conductive Coatings
Fiber Laser Marking Systems and
Industrial Lasers for variety of applications.
Full turnkey Wafer Probe, Component Assembly & Final Test Manufacturing Services (OSAT) For Optical and MEMS products only.
Ultra High Temp (270C) Process Trays/Boats
Shipping Trays (Jedec and Custom)
Tape & Reel
Moisture Barrier Bags
Full turnkey wafer probe component module assembly, and final test manufacturing sevices (OSAT)
2D and 3D Package Inspection Systems
Wafer Bump Inspections Systems