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Wafer Probe & Final Test

SunSil is proud to represent some of the leading manufacturers in support of Integrated Circuit Probe and Final Test  process and requirements;
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  • Wafer Packing and Shipping Materials
  • Anti Static ESD safe Materials
  • ST-Poly Conductive Coatings
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  • Fiber Laser Marking Systems and
  • Industrial Lasers for variety of applications.
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  • Full turnkey Wafer Probe, Component Assembly & Final Test Manufacturing Services (OSAT) For Optical and MEMS products only.
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  • Ultra High Temp (270C) Process Trays/Boats
  • Shipping Trays (Jedec and Custom)
  • Tape & Reel
  • Moisture Barrier Bags
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  • Full turnkey wafer probe component module assembly, and final test manufacturing sevices (OSAT)
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  • 2D and 3D Package Inspection Systems
  • Wafer Bump Inspections Systems
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